Responsible for SFAB production Chip Probing (CP) Yield enhancement
职责（Responsibilities）

1.1 This position requires a motivated and flexible individual with experience on extensive integrated circuit product management and knowledge of the wafer fabrication and test of analog integrated circuits.
1.2 Work with ABG or DBG BU Product Engineers to set up product healthy indicators for SFAB production, and to drive the products’ yield improvement continuously.
1.3 Must be able to interface effectively and establish credibility quickly with the cross-functional team and lead/drive the team to provide a solid corrective actions on CP yield loss.
1.4 Be responsible for keeping SFAB process stability through monitoring typical product’s CP yield and data mining on CP test, PCM test and Module process parameter .
2. 任职资格（Qualifications）
2.1 教育背景（Education）
Bachelor’s degree, Masters preferred. Degree in electrical engineering preferred but other science/engineering degrees acceptable if have related experience in the semiconductor industry.
2.2 工作经验（Work experience）
2.1 The candidates would be more preferred with ＞2 years of semiconductor industry experience.
2.3 知识和技能（Knowledge and Skills）
2.3.1 Master on Semiconductor Physics and Semiconductor Device;
2.3.2 understand on analog integrated circuit in circuit structure, fab process , basic test methodology, and Product Failure analysis basics;
2.3.3 Be good at data mining skills and logical thinking;
2.3.4 Excellent in written and verbal communication skills