职位详情
年终奖金
五险一金
餐费补贴
领导好
发展空间大
公司规模大
管理规范
上市公司
带薪年假
定期体检
Principal Product Engineering - HPP
Join a growing and dynamic IP team and help the development of best in class digital and mixed signal IP products. This is a tremendous opportunity to work with an experienced team focusing on development of high-performance IP related to protocols such as PCIe, USB, DPHY, and Ethernet PHYs. The role will be an important in organization responsible for IP activities in Post Silicon Bring up and Pre-Silicon integration for the Customers.
Primary Responsibilities:
1.Responsible for supporting integration/customization/post silicon deployment of CDNS Serdes IP, mainly focus on Post Silicon bring up and debug for Customers.
2.Support MPPHY and controller SOC integration reviews and integration questions.
3.Assist customers with RTL/Gate simulations and timing closure.
4.Participate and run reviews for CDNS documentations and update R&D team with the latest customer feedback.
5.Working with global (US, west and east coast) teams, which work in different time-zones.
Position Requirements:
1.M.S. Electrical or Computer Engineering (or similar degree).
2.5 years+ of overall experience.
3.Very strong experience in silicon bring up with lab equipment (Scope/Bert/PCIe exerciser/analyzer)
4.Very strong experience in PCIe protocol, PCIe LTSSM link stable analysis, PCI Compliance test.
5.Experience in Ethernet or USB or DP or JESD will be plus.
6.Experience in CTLE or DFE or VGA will be plus.
7.Verilog RTL and gate simulation experience.
8.Familiar with board design. Ability to read schematics and conduct SI/PI reviews for customer board implementation.
9.Occasional domestic and international business trips.
Preferred Qualifications:
1.Know the knowledge of Serdes.
2.Know the PCIe protocol.
其他信息
语言要求:英语
公司介绍
1992年Cadence公司进入中国大陆市场,迄今已拥有大量的集成电路(IC)及系统级设计客户群体。在过去的三十多年里,Cadence公司在中国不断发展壮大,建立了北京、上海、深圳、南京分公司,并于2008年将亚太总部设立在上海,Cadence中国现拥有员工超过1000人。北京研发中心和上海研发中心主要承担美国总部EDA软件研发任务,此外还在南京设立专门的设计IP研发团队,力争提供给用户更加完美的设计工具和全流程服务。Cadence在中国拥有强大的技术支持团队,提供从系统软硬件仿真验证、数字前端和后端及低功耗设计、数模混合RF前端仿真与DFM以及后端物理验证、系统分析和多物理场仿真、计算流体力学、SiP封装以及PCB设计等技术支持。
工商信息
以下信息来自
注册地址
中国(上海)自由贸易试验区东育路221弄1号5-9层(实际楼层为4-8层)
统一社会信用代码
91310115580579548F